From particle size analyzer, it is clear that as shown in Fig. Nayak, S.K., Mohanty, S. & Nayak, S.K. 0000083418 00000 n The discussed experimental values of TC of different hybrid epoxy composites are examined by different simple analytical models such as Maxwell equations, model developed by Hashin–Shtrikmann for lower bound values and series model or the inverse rule of mixture equation for lower bound results. [10], for the hybrid of 50 wt% of a 5-µm AlN particle with 6 wt% of GO hybrid filler, the TC of epoxy composite enhanced to 2.27 W/mK. This creates an impact on the surface area and wettability of reinforcement [30, 31]. It was attributed that the four optimized compositions of GO, RGO, h-BN and mh-BN with epoxy show a better result with respect to high filler-loaded epoxy composites. Among these fillers, graphene oxide (GO) and hexagonal boron nitride (h-BN) hybrid attracts researchers to enhance thermal conductivity with the creation of 3D percolation threshold network inside the matrix which can strain thermal budgets of attached electronic devices [15]. After the modification of h-BN, the few minor ingestion peaks show up close to 2973 cm−1, which represents the C–H extending vibrations of the hydrocarbon chain of the addition of APTES [20,21,22]. To modify this epoxy (TC ~ 0.21 W/mK) to get required properties, blending of high intrinsic thermal conductive fillers has been incorporated into matrix [3]. 11). Out of different surface preparation methods, mechanical polishing was adopted for creating strong and durable adhesive–substrate bond strength. SN Appl. The reported results were the average of three measurements considering standard deviation [24, 25]. 0000005971 00000 n 0000073213 00000 n The maximum value of thermal conductivity is 1.416 W/mK which is obtained due to the addition of RGO (4.5 wt%) and mh-BN (40 wt%) hybrid in an epoxy matrix. It is clear that adding GnP or BN enhances the thermal conductivity of epoxy … The required quantities of fillers were dried in a vacuum oven for 2 h at 60 °C. a XRD patterns of GO and RGO, b SEM images of GO (i) and RGO (ii). The type of filler, concentration of particles, their size and shape will determine the thermal conductivity of the product. H-BN is two-dimensional white solid materials having mass density 2.29 g/cm3. 9. H-BN is recognized as white graphite, isoelectric with carbon possess, the high intrinsic in-plane thermal conductivity of 30–300 W/mK. In the case of RGO, a new peak for 2θ = 32° with d = 0.373 nm signifies the exclusion of the majority of functional groups. 0000009334 00000 n In Fig. Thermal conductivity of 0.68 W/(m•K) Low exotherm Convenient 1A:1B volume mix ratio High compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals, … Thermal stability of fillers and hybrid composites was carried out by a thermogravimetric analyzer (TGA, TA Instruments, USA) using indium as the reference material according to ASTM E1868. To enable a wide range of applications including high thermal conductivity at comparable less filler loading was the target of this work. This is because of the formation of long-range 3D conducting networks for phonon transfers inside the filler–matrix system and effect of h-BN on TC of hybrid composites, as the synergistic effect of h-BN with GO and RGO was quite appreciable. The prepared composites were poured into a mold and allowed to cure at room temperature with a load on it for 24 h. Some amounts of hybrids composites were used in the fabrication of lap shear joint specimens. Ltd. (Bangalore, India). This work demonstrates a new insight to fabricate a high thermal conductive hybrid composite. 0000073005 00000 n SEM of GO [Fig. However, 3D network of highly oriented graphene would be used to fabricate high-quality thermal conductive network. In: IOP conference series: materials science and engineering, vol 274, no. FTIR spectra of h-BN and mh-BN (a) and GO and RGO (b). This was also due to the compatibility of GO and mh-BN as they are iso-structure and having more number of functional groups which can bind filler with matrix effectively and hybrid composites with substrate [18]. Therefore, the interfacial phonon scattering and thermal resistance inside the epoxy are reduced efficiently. The TGA curve of neat epoxy and the four optimized hybrid composites is illustrated in Fig. The material is ideal for applications requiring a self-leveling room temperature cure and better than average thermal conductivity. As the modified h-BN has the ability for better dispersion within the matrix, the tensile strength has increased, and consequently, mh-BN/GO4/epoxy hybrid composite showed improved lap shear strength of 8.1 MPa with respect to mh-BN/RGO4/epoxy hybrid composite with lap shear strength of 7.6 MPa. Then flexural and impact strength of hybrid composites named as h-BN/GO4/epoxy and h-BN/RGO4/epoxy decrease dramatically with respect to neat epoxy and made a small enhancement when modified h-BN (mh-BN) is loaded into the epoxy instead of pristine h-BN represented as mh-BN/GO4/epoxy and mh-BN/RGO4/epoxy. 0000005071 00000 n J Miner Mater Charact Eng 3(02):76, Eichler J, Lesniak C (2008) Boron nitride (BN) and BN composites for high-temperature applications. The particle size distribution of h-BN is shown in Fig. Comparison property studies of these above-mentioned four hybrid composites are described by lap shear strength, flexural strength, impact strength and thermogravimetric analysis. Kf and Km are the thermal conductivities of filler and matrix, respectively. Google Scholar, Gu J, Zhang Q, Dang J, Xie C (2012) Thermal conductivity epoxy resin composites filled with boron nitride. Different types of failure/fracture are shown in Fig. In a similar way, we can identify the reason behind the thermal decomposition temperature of sample mh-BN/GO4/epoxy hybrid composite is 372.82 °C and sample mh-BN/RGO4/epoxy hybrid composite is 374.53 °C. To get more modified h-BN (mh-BN), the above process was followed as per discussed proportionate. b Thermal conductivity of h-BN and mh-BN–epoxy composites with different filler fractions. A pre-mixed, degassed, tested and frozen epoxy… It was also due to the dispersion ability of RGO as filler in the epoxy matrix to minimize the agglomeration and voids [17]. [1] prepared electrical insulating epoxy composite using silane-treated BN nanoplatelets with a maximum TC of 5.24 W/mK. A powerful strategy to enhance the thermal conductivity of liquid crystalline epoxy resin (LCER) by simply replacing the conventional amine cross-linker with a cationic initiator was developed. The TC is 1.416 W/mK with 44.5 (4.5 RGO + 40 mh-BN) wt% loading of hybrid filler. 9(3)). This is due to the better distribution of mh-BN as compared to pristine h-BN. Due to the rapid advent of the highly efficient integrated circuit, thermal management through thermal interface materials (TIMs) has become a great challenge [1]. The absence of a 3534 cm−1 peak in RGO reveals the absence of OH group after reduction. 0000002122 00000 n All the peaks of h-BN are reliable with the standard (JCPDS: 34-0421) h-BN peaks. With the addition of 44.5 wt% of the total hybrid filler of unmodified h-BN and RGO, the fracture line has been created on the surface marked under the white circle. 13c, d. SEM images of h-BN/RGO4/epoxy (a, b), mh-BN/RGO4/epoxy (c, d). J Mater Chem A 2(43):18246–18255, Kumar R, Nayak SK, Sahoo S, Panda BP, Mohanty S, Nayak SK (2018) Study on thermal conductive epoxy adhesive based on adopting hexagonal boron nitride/graphite hybrids. From the particle size analysis and the SEM micrograph,Query it is obvious that the pristine h-BN has an average lateral size of 2 µm which also exhibits a fine flaked structure and even surface. It was also cited that due to the iso-structure of h-BN and RGO, the compatibility between two hybrid particles enhances [18, 19]. Different analytical models also approved thermal conductivity enhancement. 0000004421 00000 n 5200 exhibits a high thermal conductivity … 2b the mean lateral dimension of GO is 10.51 µm. At 40 wt% loading of h-BN and mh-BN with epoxy, the TC values were observed at 0.53 and 0.59 W/mK, respectively. 0000005658 00000 n 10b) for four different optimized compositions of GO/RGO/h-BN/mh-BN/epoxy hybrid composites along with neat epoxy. All the terms in Eq. Thermal conductivity measurements In-plane and transverse thermal conductivity … 0000005094 00000 n But RGO cannot transfer its mechanical strength as aromatic rings restore. Also, Aradhana et al. From Fig. A solution of 100 ml ethanol and 6 g of h-BN was prepared by 20 min stirring which is illustrated in Fig. 1 and the thermal conductivity k r of the epoxy resin is 0.1 W.m-1.K-1 at 80 K and it is 0.25 W.m-1.K-1 at 0.25300 K. II. Polym Adv Technol 23(6):1025–1028, Srinivas K, Bhagyashekar MS (2015) Thermal conductivity enhancement of epoxy by hybrid particulate fillers of graphite and silicon carbide. Conductive heat … where K is the TC of the composite. Therefore, lap shear, flexural and impact strength of h-BN/RGO4/epoxy hybrid composites is less than mh-BN/RGO4/epoxy hybrid composite which is shown in Figs. 10a, b, it is also observed that matrix carrying GO with h-BN and GO with mh-BN has little higher properties than corresponding RGO with h-BN and RGO with mh-BN. Due to the presence of hydroxyl, carboxyl and carbonyl groups, GO becomes hydrophilic by nature. Use them to encase electronic … Also, Maxwell, Hashin–Shtrikmann and series equations are used to verify the obtained experimental value. 0000083174 00000 n Then, curing agent was added followed by 5 min sonication. The h-BN powders (255475-50G) with dimension ~ 2 µm were obtained from Sigma-Aldrich Co., Germany. The surface topography/morphology (captured under contact mode) of hybrid composites with 2D and 3D image profile containing modified h-BN (mh-BN) and unmodified h-BN with RGO in the epoxy matrix is demonstrated in AFM image (Fig. Figure 8 illustrates the lap shear strength of four different cured hybrid composites entitled as h-BN/GO4/epoxy, h-BN/RGO4/epoxy, mh-BN/GO4/epoxy and mh-BN/RGO4/epoxy with respect to lap shear strength value of neat epoxy. At room temperature, 10 wt.% short-MWCNT/epoxy composite showed thermal conductivity of 0.35 W/mK, which was nearly twice of the thermal conductivity of epoxy, 0.2 W/mK. 5b, GO sample shows a broad and outstanding absorption peak at 3534 cm−1, which can be attributed to the stretching vibration of –OH group. They also have lateral flexibility with a high aspect ratio which can improve the flexural strength of composites if reinforced [27]. Cite this article. Epoxy is well known for its excellent mechanical properties and thermal stability, best adhesion and good electrical insulation properties and compatibility with many materials [2, 3]. So, this type of hybrid composite is suitable for a wide spectrum of thermal management and electrical application. [2] reported that silane-modified BN epoxy resin composites at 60% mass fraction are 1.052 W/mK. PERFORMANCE PROPERTIES. Surface fillers in … 12a. Wang Z, Fu Y, Meng W, Zhi C (2014) Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers. The thermal and mechanical properties of each of the fabricated hybrid composites were investigated at various filler fractions and correlated with monofiller-loaded epoxy composites. 0000002599 00000 n As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and RGO are incorporated. The source of the X-ray is CuKα radiation. As compared to sample manifest as h-BN/GO4/epoxy hybrid composite, containing the same amount of filler as sample h-BN/RGO4/epoxy hybrid composite, the only difference is GO, RGO and having less thermal decomposition temperature, i.e., 376.71 °C. Which restacking of RGO layers occurs K m ) of hydroxyl, carboxyl and carbonyl groups, GO hydrophilic! 0.05–0.1 mm was prepared to make lap joints APTES ) was used to fabricate high-quality thermal conductive hybrid which! And GO and RGO are incorporated h-BN/GO hybrid composites with different filler fractions substrates carefully... Describes the measurement of thermal conductivity values of these hybrid filler composite systems were increased compared! Steel substrates by carefully rubbing with 400-grade emery paper and cleaning with acetone be electrically! In a vacuum oven for 2 h by ultrasonic sonicator for proper dispersion of particles their. 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Low-Temperature epoxy resins and corresponding hardener were mixed in a ratio of 10:1 with hybrid particles images GO! With epoxy thermal conductivity w/mk h-BN with RGO is evidently visible in Fig are illustrated in Fig 0.293 0.311. On fabricating epoxy-based hybrid composites were fabricated using hand lay-off technique which shown... The effect of both the particles [ 10 ] many researchers reported that at vol... Particles in the diagram below fabricated hybrid composites are showing better results than native epoxy. Matrix improves improve the flexural strength, flexural strength and thermogravimetric analysis 24. Consider voids with carbon possess, the recovery sp2 type structure establishes more π–π interactions which! J heat mass Transf 114:727–734, Lee JK ( 2007 ) Prediction thermal. Time of oxidation Table 1 shows that the particle size distribution of h-BN loading the composite showed TC value 0.8! Tao Huang et al the presence of hydroxyl, carboxyl and carbonyl groups GO... Conducted considering the single lap shear, flexural strength and impact strength ( a, b contain height! Loading of hybrid particles with epoxy chemical treatment to obtain RGO graphene epoxy... They can be either electrically conductive or electrically insulative [ 1 ] electrical. With monofiller-loaded epoxy composites composite systems were increased as compared to pristine h-BN ( mh-BN ), the TC were. Continuous phase ( matrix ), mh-BN/RGO4/epoxy ( c, d mh-BN/GO hybrid filler composite systems were increased as to! Fraction described epoxy thermal conductivity w/mk Fig composites were fabricated using hand lay-off technique which is shown Table! Better TC value at this loading was 1.6 W/mK [ 37 ] 1 describes. The few-layer structure with less interplanar spacing between monolayers [ 35 ] having mass density 2.29 g/cm3 composites... Mechanical polishing was adopted for creating strong and durable adhesive–substrate bond strength area of 10 by 10.... ) of different surface preparation methods, mechanical polishing of steel plate as substrates network of highly graphene! ; Coefficient of thermal conductivity, lap shear joint of stainless steel plate as.!